Thermal management solutions for stacked integrated circuit devices (Q117477890)
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US patent 11482472
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Thermal management solutions for stacked integrated circuit devices |
US patent 11482472 |
Statements
Thermal management solutions for stacked integrated circuit devices (English)
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Feras Eid (Chandler, AZ)
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Adel Elsherbini (Chandler, AZ)
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Johanna Swan (Scottsdale, AZ)
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