Connecting a component to a substrate by adhesion to an oxidized solder surface (Q118175683)
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US patent 11228124
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Connecting a component to a substrate by adhesion to an oxidized solder surface |
US patent 11228124 |
Statements
Connecting a component to a substrate by adhesion to an oxidized solder surface (English)
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Mark K. Hoffmeyer (Rochester, MN)
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Steven P. Ostrander (Poughkeepsie, NY)
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Thomas Weiss (Poughkeepsie, NY)
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Thomas E. Lombardi (Poughkeepsie, NY)
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