Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer (Q119823791)
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US patent 11279615
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer |
US patent 11279615 |
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Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer (English)
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Hung-Hua Lin (Taipei)
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Chang-Ming Wu (New Taipei)
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Chung-Yi Yu (Hsin-Chu)
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Ping-Yin Liu (Yonghe)
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Jung-Huei Peng (Jhubei)
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