Through silicon vias filled with planarized carbon nanotube bundles (Q33444164)
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English | Through silicon vias filled with planarized carbon nanotube bundles |
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Through silicon vias filled with planarized carbon nanotube bundles (English)
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Teng Wang
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Kjell Jeppson
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Niklas Olofsson
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Johan Liu
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4 November 2009
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20
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48
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485203
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