The R1 conjugative plasmid increases Escherichia coli biofilm formation through an envelope stress response. (Q36672604)
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scientific article published on 14 March 2008
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | The R1 conjugative plasmid increases Escherichia coli biofilm formation through an envelope stress response. |
scientific article published on 14 March 2008 |
Statements
The R1 conjugative plasmid increases Escherichia coli biofilm formation through an envelope stress response (English)
Xiaole Yang
1 reference
1 reference