Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation (Q61950450)
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scientific article published in May 1998
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation |
scientific article published in May 1998 |
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Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation (English)
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May 1998
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13
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05
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1307-1317
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