wafer bonding (Q677010)
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packaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulation
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | wafer bonding |
packaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulation |
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Wikipedia(5 entries)
- cawiki Unió d'oblies
- dewiki Waferbonden
- enwiki Wafer bonding
- itwiki Collegamento su wafer
- jawiki 基板接合